https://www.tomshardware.com/pc-components/cpus/amd-ryzen-9000-launch-delay-due-to-typo-ryzen-7-9700x-ryzen-5-9600x-confirmed
AMD has apparently encountered a marking issue that has morphed into a marketing issue.
![AMD may have delayed Ryzen 9000 launch due to a typo — mislabeled Ryzen 7 chip emerges, Ryzen 5 9600X impacted, too [Updated]](https://lemmy.world/pictrs/image/30716744-c330-459a-9c20-58c5412e4d2f.png)
if the problem is just a simple digit on a part that is permanently covered by a hunk of aluminum then i am willing to help them dispose them. Send me many units and I won't even charge any disposal fee
I did something like this once. I swapped the "power" and "status" LED silkscreen labels on 100 PCBs on a custom device. The design rules checker in my software doesn't catch labeling errors.
If you think your design is finally done.... it's not. Check it again. Go to bed, and check again in the morning. And check again in the evening.
When I was a kid my dad had a computer. A 486. It didnt have a CMOS battery. He went to the computer fair to talk to the guy he bought it from and he got another copy of the manual.
Manual said to use some weird 3.7V lipo pack across header J1 or something like that.
He did that.
And it turned out that was the wrong manual.
The battery exploded. Like, loud as hell. 3.5" drive bay covers shot clear across the room and put a mark in the closet door that's still there to this day.
Since it's a PCB, unlikely. It's likely hardwired In the circuit. You'd need to physically change the printed label in that case
Not particularly harmful, but so embarrassing. I think many of us have made similar mistakes. Thanks for the laugh.
Waiting for the re-drawing of the text on the lid to effect the flatness of the cpu and ruin cooling or something.....
Still, a much nicer issue to have than Intel is fighting!
It's still less conductive than metal. The latest/best CPU coolers have started to ship coolers with cold plates that are shaped to deliberately curve slightly to match how intel/AMD CPUs curve differently
That's not the problem the poster here is referring to.
Intel designed those stupid rectangular chip packages. They then put those stupid wings on the heat spreader, which is the only place the stock contact frame holds the chip package down. So even though the heatsink sits on top of all that, there's nothing holding the corners of the chip package down, and over time the heat and cool cycles are causing the package substrate to warp. There are now third party contact frames that make contact with the entire edge of the chip to help prevent that.
Note this isn't related to the issue with the 13th/14th gen Intel chips breaking randomly, this is problem with the form factor itself.
It's Intel's proprietary technology along with high power consumption and high heat output, it would be copyright infringement to have that on AMD CPUs.
AMD: the labeling on our processors is wrong and that's a serious issue that requires a recall.
Intel: our processors are frying themselves, we have a software fix in the works, but there's no way to guarantee preventing it in the mean time and no matter how long you've had the processor before it stops working properly or just flat out dies, we aren't going to recall, replace, repair, or otherwise compensate you for the crappy expensive product we sold you.
I mean it's sad when an issue that would likely lead to confusion and scamming people, but otherwise just a visual issue is more important to one company than a serious defect is to another, and that it's such a "feel-good" thing to see the former when it should be a major problem that their QE didn't catch that before shipping a major product.